Medium temperature (SAB) lead-free solder paste is made by using special flux and spherical tin-silver eutectic alloy powder with very low oxide content.Excellent continuous printing resolution; In addition, the solder paste contained in this product uses a highly reliable low-ionic halogen activator system to make the residue after reflow extremely high even if it is no-cleanReliability. Printing characteristics 1.) During continuous printing, its viscosity has little change over time, and very stable printability can be obtained. 2.) For circuits with a pitch of 0.4 mm and above, fine printing can be completed. 3.) It has excellent weldability and can exhibit proper wettability in different parts. 4.) Applicable to reflow furnaces under normal atmosphere and nitrogen. 5.) Good solderability can be obtained even at extremely high peak temperature.